Engineering challenges in data centers and datacom
Data centers keep consuming more and more optical bandwidth. The move from 100G to 400G and 800G, the introduction of DP-16QAM modulation, and co-packaged optics (CPO) — where optical modules are integrated directly with network switches — are all challenges that demand advanced simulation at every level of design.
At the system level, engineers must verify power budget, BER margin, and component compatibility in spine-leaf topologies with hundreds of transceivers. At the component level, PIC designers for transceivers must iterate through coupler, modulator, and detector geometries before sending a wafer to the FAB. At the circuit level, laser drivers and TIA amplifiers must be co-designed with the optical path.
iSymulacje provides tools to work at every one of these levels — from photonic-layer optimization with OptiOmega, through circuit-level analysis in OptiSPICE, to system simulation in OptiSystem.
How does our software support design?
| Product | Role in this area |
|---|---|
 | Simulating optical links, verifying power budget, BER analysis for data center topologies |
 | Generating compact models of PIC components for 400G/800G transceivers |
 | Designing laser drivers, TIAs, and equalizers at the transistor level |
 | FDTD simulation of photonic components in transceivers (couplers, modulators) |
verifying a 400G-DR4 transceiver
Component optimization
The geometry of a silicon Mach–Zehnder modulator was optimized in OptiFDTD using FDTD simulation. GPU acceleration significantly shortened computation time across successive design iterations.
Compact model generation
The simulation results were imported into OptiOmega, where the resulting scattering parameters (S-parameters) were used to create a compact model for circuit-level simulation.
Circuit analysis
The compact model was used in OptiSPICE to analyze the transmitter path with the Mach–Zehnder modulator. Simulations revealed degraded transmission performance above 53 GHz, indicating the need for design optimization.
PAM4 transmission verification
After the changes were implemented, the full transceiver model was verified in OptiSystem, running a 400G-DR4 transmission simulation with PAM4 modulation across the complete optical path, accounting for the fiber and FEC error-correction requirements.
Verified design
The multi-level design flow, from component optimization to system-level simulation, confirmed the required operating margin and allowed the design to be readied for tape-out, reducing the risk of costly fixes after PIC production began.
Frequently asked questions
Data centers and Datacom
Do Optiwave tools support PAM4 and DP-16QAM modulation formats?
Yes. OptiSystem supports PAM4, NRZ, DP-QPSK, DP-16QAM, and other modulation formats used in modern data center and telecom transceivers.
What is co-packaged optics, and how can it be simulated?
CPO integrates the optical module directly with the switch ASIC. OptiSPICE enables joint electrical-optical co-simulation, while OptiOmega generates compact models of photonic components for CPO PDK libraries.
Is there support for photonic platforms other than silicon (e.g. InP, SiN)?
Yes. Optiwave tools work with any material platform. Optical material properties are fully user-configurable.
Have a specific challenge in this field?
Our engineer will reply within 1 business day and advise on tools and licensing options.
Ask an engineerLooking for OptiSystem?
Get a 14-30 day trial to test OptiSystem with full technical support during your current project.
Get OptiSystem trial